Display device and method for manufacturing display device

ABSTRACT

A display device includes a display panel having a display area and a non-display area, the non-display area being disposed at a peripheral portion of the display area and having a bending area; an integrated circuit (IC) disposed in the non-display area to drive the display panel; a first layer formed between the display area and the IC and covering the bending area; and a first member covering the IC and the first layer and overlapping with the bending area.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2018-0038285, filed on Apr. 2, 2018, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Exemplary implementations of the invention relate generally to a displaydevice and a method for fabricating the same and, more particularly, toa bendable display device and a method for fabricating the same.

Discussion of the Background

Display devices become more and more important as multimedia technologyevolves. Accordingly, a variety of types of display devices such asliquid-crystal display (LCD) devices and organic light-emitting display(OLED) devices are currently used.

Recently, electronic devices with mobility are widely used. In additionto small electronic devices such as mobile phones, tablet PCs are widelyused as mobile electronic devices.

Such mobile electronic devices include a display device for presentingvisual information in the form of image or video to users in order tosupport a variety of features. As other components for driving a displaydevice become smaller and smaller, the proportion of the display devicein the electronic device has been gradually increasing. Accordingly,there is ongoing research to develop a structure of a display devicethat allows its elements to be bent at a certain angle.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Applicant discovered that the design of bendable display devicestypically result in bending stress and static electricity orelectromagnetic noise that adversely affects the operation and/orreliability of the display device.

Display devices constructed according the principles and exemplaryembodiments of the invention are capable of mitigating stress caused bybending.

Display devices constructed according the principles and exemplaryembodiments of the invention also provide a display device thatsuppresses the adverse influence of static electricity orelectromagnetic noise

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

According to an aspect of the invention, a display device includes: adisplay panel having a display area and a non-display area, thenon-display area being disposed at a peripheral portion of the displayarea and having a bending area; an integrated circuit (IC) disposed inthe non-display area; a first layer formed between the display area andthe IC and covering the bending area; and a first member covering the ICand the first layer and overlapping with the bending area.

The display device may further include: an output pad unit disposed onan outer side of the IC in the non-display area; and a flexible printedcircuit board electrically connected to the output pad unit.

The display device may further include: a ground electrode disposed onthe flexible printed circuit board, and the first member may beconnected to the ground electrode to reduce interference from staticelectricity or electromagnetic waves in the non-display area.

The first member may include a first cover member having a firstinsulating layer, a conductive layer disposed on the first insulatinglayer, a second insulating layer disposed on the conductive layer, andmay further include an opening exposing a part of the conductive layerthrough the first insulating layer, and the conductive layer may come incontact with the ground electrode via the opening.

The display device may further include: a polarization layer disposed onthe display panel; a first adhesive layer disposed on the polarizationlayer; and a cover window disposed on the first adhesive layer.

A part of the first cover member may come in contact with the firstadhesive layer.

A part of the first member may contact the first adhesive layer, a partof the first member is disposed between the first adhesive layer and thefirst layer, and the first layer and the first member abut thepolarization layer.

The protective layer and the first cover member may come in contact withthe polarization layer.

The display device might further include: a support panel disposedbetween the display area and the IC, and wherein the first layercomprises a protective layer and the first member comprises a firstcover member. The IC may completely overlap with the first member.

The first member may include a first insulating layer, a conductivelayer disposed on the first insulating layer, and a second insulatinglayer disposed on the conductive layer.

The first insulating layer may abut the IC.

The first insulating layer may include a first non-conductive adhesivelayer, the conductive layer may include a conductive adhesive layer, andthe second insulating layer may include a second non-conductive adhesivelayer.

The display device may further include: a second member disposed on thedisplay panel and overlapping with the bending area.

According to another aspect of the invention display device includes: adisplay panel having a display area and a non-display area, thenon-display area being disposed at a peripheral portion of the displayarea and having a bending area; a integrated circuit (IC) disposed inthe non-display area to drive the display panel; a first layer formedbetween the display area and the IC and covering the bending area; and afirst member covering the IC and the protective layer and overlappingwith the bending area, and comprises a conductive member to reduceinterference from static electricity or electromagnetic waves in thenon-display area.

The display device may further include: a ground electrode disposed onthe flexible printed circuit board, wherein the conductive member isconnected to the ground electrode.

According to yet another aspect of the invention, a method formanufacturing a display device includes the steps of: preparing adisplay panel having a display area and a non-display area, thenon-display area being disposed at a peripheral portion of the displayarea and having an integrated circuit (IC) therein; forming a protectivelayer between the IC and the display area; forming a first member tocover the drive IC and the protective layer; and bending the displaypanel to form a bending area between the drive IC and the display area.

The method may further include disposing a second member on the displaypanel.

The method may further include the step of: connecting a flexibleprinted circuit board to the non-display area.

The first member may further include a first cover member that partiallycovers the flexible printed circuit board.

The method may further include the step of: forming a ground electrodeon the flexible printed circuit board; and connecting the first covermember to the ground electrode.

The first cover member may include a first insulating layer, aconductive layer and a second insulating layer stacked on one another,and the step of connecting the first cover member to the groundelectrode may include recessing the first insulating layer to form anopening via which the conductive layer is exposed, and electricallyconnecting a part of the conductive layer exposed via the opening withthe ground electrode.

According to principles and exemplary embodiments of the invention, atleast following effects can be achieved:

The bending area of the display panel can be protected.

The bending stress generated in the bending area due to the bending canbe distributed.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a cross-sectional view of a display device according to anexemplary embodiment of the invention;

FIG. 2 is a view showing some elements of the display device accordingto the exemplary embodiment shown in FIG. 1;

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 2;

FIG. 4 is an enlarged view of portion A of FIG. 1;

FIG. 5 is a cross-sectional view of a display device according to anexemplary embodiment of the invention;

FIG. 6 is a cross-sectional view of a display device according to anexemplary embodiment of the invention;

FIG. 7 is a view showing a display device according to another exemplaryembodiment of the invention;

FIG. 8 is a cross-sectional view taken along line II-II′ of FIG. 7; and

FIG. 9 is a cross-sectional view of a part of a display device accordingto another exemplary embodiment of the invention.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Hereinafter, exemplary embodiments of the invention will be described indetail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view of a display device according to anexemplary embodiment of the invention. FIG. 2 is a view showing someelements of the display device according to the exemplary embodimentshown in FIG. 1; FIG. 3 is a cross-sectional view taken along line I-I′of FIG. 2. FIG. 4 is an enlarged view of portion A of FIG. 1.

Referring to FIGS. 1 to 4, a display device according to an exemplaryembodiment of the invention includes a display panel PA, a driveintegrated circuit (IC) 130, a protective layer 500, and a first covermember 600.

The display device according to an exemplary embodiment of the inventionmay further include a support panel 400, a polarization layer POL, afirst adhesive layer AD1, and a cover window CW.

Specifically, the display panel PA, the polarization layer POL, thefirst adhesive layer AD1, and the cover window CW may be sequentiallystacked on the support panel 400 as shown in FIG. 1.

For convenience of illustration, the display panel PA will be describedfirst, and then the other elements and the relationship among them willbe described.

Referring to FIG. 2, a display area DA and a non-display area NDA may bedefined on the display panel PA.

The display area DA may be defined as an area for displaying an image. Aplurality of pixels PX for presenting an image may be disposed in thedisplay area DA. The non-display area NDA is defined as an area that isdisposed outside the display area DA and does not display an image. Thenon-display area NDA may surround the display area DA, for example.Although the non-display area NDA is shown as surrounding the displayarea DA in FIG. 2, this is merely illustrative. In another exemplaryembodiment, the non-display area NDA may be disposed adjacent to onlyone side or the other side of the display area DA or may be disposedadjacent to either side of the display area DA separately.

In an exemplary embodiment, the non-display area NDA may include a firstsubsidiary non-display area NDA1 and a second subsidiary non-displayarea NDA2. The first subsidiary non-display area NDA1 is disposedadjacent to one side of the display area DA and may include a bendingarea BA described later. The second subsidiary non-display area NDA2 mayrefer to the rest of the non-display area other than the firstsubsidiary non-display area NDA1 and may not include the bending areaBA. For convenience of illustration, FIG. 2 shows the display panel PAbefore it is bent.

The drive IC 130 and an output pad unit 140 may be disposed in the firstsubsidiary non-display area NDA1. The drive IC 130 may generate signalsnecessary for driving the display area DA and transmit them to thedisplay area DA.

The drive IC 130 may be mounted directly on the display panel PA. Thatis to say, in the display device according to the exemplary embodimentof the invention, the drive IC 130 may be directly mounted on thedisplay panel PA by using the chip-on-panel (COP) technique.

The drive IC 130 may generate scan signals and/or data signals based onthe driving signal supplied from the output pad unit 140 and providethem to the pixels PX.

To this end, a plurality of input lines 150 may be disposed in the firstsubsidiary non-display area NDA1 to electrically connect the output padunit 140 with the drive IC 130.

In addition, a plurality of output lines 160 for electrically connectingthe drive IC 130 with the display area DA, especially, the plurality ofpixels PX may be disposed in the first subsidiary non-display area NDA1.

In an exemplary embodiment, the drive IC 130 may be electricallyconnected to the plurality of input lines 150 and/or the plurality ofoutput lines 160 by an anisotropic conductive film (ACF). That is tosay, by interposing an anisotropic conductive film containing conductiveparticles between one end of the input lines 150 and/or the output lines160 and the drive IC 130, the input lines 150 and/or the output lines160 may be electrically connected to the drive IC 130.

It is, however, to be understood that the invention is not limitedthereto. The input lines 150 and/or the output lines 160 may beelectrically connected to the drive IC 130 in a variety of ways known inthe art.

The output pad unit 140 may be disposed on one side of the firstsubsidiary non-display area NDA1. In an exemplary embodiment, the outputpad unit 140 may be extended along the edge of the display panel PA.

The output pad unit 140 may include a plurality of output pads 141. Theplurality of output pads 141 may be electrically connected to a flexibleprinted circuit board FPC.

According to an exemplary embodiment of the invention, the displaydevice may further include a flexible printed circuit board FPC. In anexemplary embodiment, the flexible printed circuit board FPC is made ofa flexible material and can be at least bent or rolled.

The flexible printed circuit board FPC can transmit signals necessaryfor driving to the output pad unit 140. To this end, a plurality ofcircuit patterns and a driving circuit may be formed on the flexibleprinted circuit board FPC.

The flexible printed circuit board FPC may include a substrate pad unit170. A plurality of pads may be formed in the substrate pad unit 170.

The pads formed in the substrate pad unit 170 may be electricallyconnected to the output pads formed in output pad unit 140,respectively. Alternatively, one of the pads formed in the substrate padunit 170 may be electrically connected to n pads formed in the outputpad unit 140 or vice versa.

In an exemplary embodiment, the substrate pad unit 170 may beelectrically connected to the output pad unit 140 by an anisotropicconductive film (ACF). Specifically, an anisotropic conductive filmcontaining conductive particles may be interposed between the substratepad unit 170 and the output pad unit 140 to electrically connect them.

It is, however, to be understood that the invention is not limitedthereto. For example, in other implementations, the pads of thesubstrate pad unit 170 may be in contact with the pads of the output padunit 140 to be electrically connected to thereto.

A bending area BA may be defined between the display area DA and thedrive IC 130. The bending area BA is defined as a region where thedisplay panel PA is bent to at least one curvature.

That is to say, the curvature of the front surface or rear surface ofthe display panel PA in the bending area BA may be larger than zero.

When the display panel PA is bent along the bending area BA, it may havethe shape shown in FIG. 1. Accordingly, one end of the display panel PAmay face the display area DA or the first subsidiary non-display areaNDA1.

In addition, the drive IC 130 may overlap with the display area DA ofthe display panel PA.

The bending area BA may be made of a flexible material so that it can beis bent. Specifically, the first substrate 110, which is the base of thebending area BA, may be made of a flexible material.

In an exemplary embodiment, the entire first substrate 110 may be madeof a flexible material or just the part of the first substrate 110disposed in the bending area BA may be made of a flexible material.

The display area DA may include a plurality of pixels PX for displayingan image.

Hereinafter, the cross-sectional structure of a pixel PX will bedescribed with reference to FIG. 3.

In an exemplary embodiment, the pixel PX may include a first substrate110 and an organic light-emitting diode (OLED) formed on the firstsubstrate 110.

The first substrate 110 may be an insulating substrate. In an exemplaryembodiment, the first substrate 110 may include a material such asglass, quartz and a polymeric resin. The polymer material may bepolyethersulphone (PES), polyacrylate (PA), polyacrylate (PAR),polyetherimide (PEI), polyethylenenapthalate (PEN),polyethyleneterepthalate (PET), polyphenylenesulfide (PPS),polyallylate, polyimide (PI), polycarbonate (PC), cellulosetriacetate(CAT), cellulose acetate propionate (CAP), or combinations thereof.

In an exemplary embodiment, the first substrate 110 may be partially orentirely made of a flexible material. Accordingly, the first substrate110 may be at least partially bent, rolled, or folded.

A buffer layer 210 may be disposed on the first substrate 110. Thebuffer layer 210 may provide a flat surface over the first substrate110. In an exemplary embodiment, the buffer layer 210 may include one ofa silicon nitride (SiNx) layer, a silicon oxide (SiO₂) layer, and asilicon oxynitride (SiOxNy) layer. The buffer layer 210 may beeliminated depending on the type of the first substrate 110, processconditions, etc.

The semiconductor layer including a semiconductor pattern ACT may bedisposed on the buffer layer 210. The semiconductor pattern ACT will bedescribed as an example of the semiconductor layer. In an exemplaryembodiment, the semiconductor pattern ACT may be made of one selectedfrom polycrystalline silicon, single crystal silicon, low-temperaturepolycrystalline silicon, amorphous silicon and oxide semiconductor or amixture thereof. In an exemplary embodiment, the semiconductor patternACT may include a channel region ACTa doped with no impurity, and asource region ACTb and a drain region ACTc doped with impurities. Thesource region ACTb is located on one side of the channel region ACTa andis electrically connected to a source electrode SE described later. Thedrain region ACTc is located on the other side of the channel regionACTa and is electrically connected to a drain electrode DE describedlater.

The first pixel insulating layer 220 may be disposed on thesemiconductor layer including the semiconductor pattern ACT. In anexemplary embodiment, the first pixel insulating layer 220 may be a gateinsulating layer. In an exemplary embodiment, the first pixel insulatinglayer 220 may be made of at least one selected from the group consistingof: an inorganic insulating material such as silicon oxide (SiOx) andsilicon nitride (SiNx), BCB (BenzoCycloButene), an acryl-based materialand an organic insulating material such as polyimide, or a mixturethereof.

A gate conductor including the gate electrode GE may be disposed on thefirst pixel insulating layer 220. The gate electrode GE may overlap withthe semiconductor pattern ACT. For example, the gate conductor mayinclude at least one of an aluminum (Al)-based metal including analuminum alloy, a silver (Ag)-based metal including a silver alloy, acopper (Cu)-based metal including a copper alloy, a molybdenum(Mo)-based metal including molybdenum alloy, chromium (Cr), titanium(Ti), and tantalum (Ta).

A second insulating layer 230 may be disposed on the gate conductorincluding the gate electrode GE. The second insulating layer 230 may bemade of at least one selected from the group consisting of: an inorganicinsulating material such as silicon oxide (SiOx) and silicon nitride(SiNx), BCB (BenzoCycloButene), an acryl-based material and an organicinsulating material such as polyimide, or a mixture thereof.

A data conductor including the source electrode SE and the drainelectrode DE may be disposed on the second insulating layer 230. Thesource electrode SE and the drain electrode DE are disposed on thesecond insulating layer 230 such that they are spaced apart from eachother. The data conductor may include at least one selected from thegroup consisting of: a metal, an alloy, a metal nitride, a conductivemetal oxide, and a transparent conductive material. In an exemplaryembodiment, the data conductor may have a single-layer structure or amulti-layers structure made of nickel (Ni), cobalt (Co), titan (Ti),silver (Ag), copper (Cu), molybdenum (Mo), aluminum (Al), beryllium(Be), niobium (Nb), gold (Au), iron (Fe), selenium (Se), tantalum (Ta),etc. In addition, an alloy formed by adding at least one elementselected from the group consisting of titanium (Ti), zirconium (Zr),tungsten (W), tantalum (Ta), niobium (Nb), platinum (Pt), hafnium (Hf),oxygen (O) and nitrogen (N) to the above-listed metal may be used as thematerials of the source electrode SE and the drain electrode DE.

The semiconductor pattern ACT, the gate electrode GE, the sourceelectrode SE and the drain electrode DE described above form a switchingelement TR2. Although the switching element TR2 is shown as a top-gatetransistor in FIG. 3, the type of the switching element TR2 is notlimited thereto. For example, the switching element TR2 may be abottom-gate transistor.

A planarization layer 240 may be disposed on the data conductor. Theplanarization layer 240 can increase the luminous efficiency of thepixel electrode 250 and the organic emission layer 270, which will bedescribed later, by removing the level difference. In an exemplaryembodiment, the planarization layer 240 may include an organic material.For example, the planarization layer 240 may include at least oneselected from the group consisting of polyimide, polyacryl, andpolysiloxane. In another embodiment, the planarization layer 240 may becomprised of an inorganic material, or may be formed as a composite ofan inorganic material and an organic material. A first contact hole CNT1may be formed in the planarization layer 240 to expose at least a partof the drain electrode DE.

The pixel electrode 250 may be disposed on the planarization layer 240.The pixel electrode 250 may be electrically connected to the drainelectrode DE exposed via the first contact hole CNT1. That is, the pixelelectrode 250 may be an anode which is a hole injection electrode. Whenthe pixel electrode 250 is an anode electrode, the pixel electrode 250may include a material having a high work function to facilitate holeinjection. In addition, the pixel electrode 250 may be a reflectiveelectrode, a transflective electrode, or a transmissive electrode. In anexemplary embodiment, the pixel electrode 250 may include a reflectivematerial. The reflective material may include, for example, at least oneselected from the group consisting of: silver (Ag), magnesium (Mg),chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu),tungsten (W), aluminum (Al), aluminum-lithium (Al—Li), magnesium-indium(Mg—In), and magnesium-silver (Mg—Ag).

The pixel electrode 250 may be formed as a single layer, for example.However, in other embodiments the pixel electrode 250 may be made up ofmultiple-layers in which two or more materials are stacked.

When the pixel electrode 250 is made up of multiple layers, the pixelelectrode 250 may include, for example, a reflective layer and atransparent or translucent electrode disposed on the reflective layer.For another example, the pixel electrode 250 may include a reflectivelayer and a transparent or translucent electrode disposed under thereflective layer. For example, the pixel electrode 250 may have, but isnot limited to, a three-layer structure of ITO/Ag/ITO.

The transparent or transflective electrode may be made of at least oneselected from the group consisting of: indium tin oxide (ITO), indiumzinc oxide (IZO), zinc oxide (ZnO), In₂O₃ (Indium Oxide), indium galliumoxide (IGO), and aluminum zinc oxide (AZO).

A pixel defining layer 260 may be disposed on the pixel electrode 250.The pixel defining layer 260 includes an opening exposing at least apart of the pixel electrode 250. The 260 may include an organic materialor an inorganic material. For example, the 260 may include a materialsuch as a photoresist, a polyimide resin, an acrylic resin, a siliconcompound and a polyacrylic resin.

The organic emission layer 270 may be disposed on the pixel electrode250 and the pixel defining layer 260. More specifically, the organicemission layer 270 may be disposed on the portion of the pixel electrode250 that is exposed via the opening of the pixel defining layer 260. Inan exemplary embodiment, the organic emission layer 270 may cover atleast a part of the sidewall of the pixel defining layer 260.

In an exemplary embodiment, the organic emission layer 270 may emit oneof red, blue and green colors, for example. In another embodiment, theorganic emission layer 270 may emit white light or emit light of one ofcyan, magenta and yellow. When the organic emission layer 270 emitswhite light, it may include a white light-emitting material, or may havea stacked structure of a red light-emitting layer, a greenlight-emitting layer and a blue light-emitting layer to emit whitelight.

The common electrode 280 may be disposed on the organic emission layer270 and the pixel defining layer 260. In an exemplary embodiment, thecommon electrode 280 may be disposed throughout the organic emissionlayer 270 and the pixel defining layer 260. In an exemplary embodiment,the common electrode 280 may be a cathode electrode. In an exemplaryembodiment, the common electrode 280 may include at least one selectedfrom the group consisting of: Li, Ca, LiF/Ca, LiF/Al, Al, Ag and Mg. Inaddition, the common electrode 280 may be made of a material having alow work function. In an exemplary embodiment, the common electrode 280may be made of at least one selected from the group consisting of:indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO),indium oxide (In₂O₃), indium gallium oxide (IGO), and aluminum zincoxide (AZO).

The above-described pixel electrode 250, organic emission layer 270 andcommon electrode 280 may constitute the organic light-emitting diodeOLED. However, this is merely illustrative. The organic light-emittingdiode OLED may have a multiple layer structure further including a holeinjection layer (HIL), a hole transport layer (HTL), an electrontransport layer (ETL), and an electron injection layer (EIL).

An encapsulation layer 300 may be disposed on the common electrode CE.The encapsulation layer 300 can prevent moisture and air, which may flowfrom the outside, from permeating into the organic light-emitting diodeOLED. In an exemplary embodiment, the encapsulation layer 300 mayinclude a first inorganic layer 301, an organic layer 302, and a secondinorganic layer 303.

The first inorganic layer 301 may be disposed on the common electrode280. The first inorganic layer 301 may include at least one selectedfrom the group consisting of silicon oxide (SiOx), silicon nitride(SiNx), and silicon oxynitride (SiONx).

The organic layer 302 may be disposed on the first inorganic layer 301.The organic layer 302 may include one selected from the group consistingof epoxy, acrylate, and urethane acrylate. The organic layer 302 canprovide a flat surface over the level difference created by the pixeldefining layer 260.

The second inorganic layer 303 may be disposed on the organic layer 302.The second inorganic layer 303 may include at least one selected fromthe group consisting of silicon oxide (SiOx), silicon nitride (SiNx),and silicon oxynitride (SiONx).

Although each of the first inorganic layer 301, the organic layer 302and the second inorganic layer 303 shown in FIG. 3 is made up of asingle layer, this is merely illustrative. That is to say, at least oneof the first inorganic layer 301, the organic layer 302 and the secondinorganic layer 303 may be made up of multiple layers.

In another exemplary embodiment, the encapsulation layer 300 may includea hexamethyldisiloxane (HMDSO) layer. More specifically, theencapsulation layer 300 may include the first inorganic layer 301, thesecond inorganic layer 303 and the HMDSO layer disposed between thefirst inorganic layer 301 and the second inorganic layer 303. That is,the above-described organic layer 302 may be replaced with the HMDSOlayer.

In an exemplary embodiment, the HMDSO layer may be formed in the samechamber after forming the first inorganic layer 301. By doing so, theprocess of forming the encapsulation layer 300 can become simpler. Inaddition, as the encapsulation layer 300 includes the HMDSO layer thatis capable of absorbing stress, the encapsulation layer 300 can havesufficient flexibility.

In an exemplary embodiment, a touch sensing layer for sensing an inputmay be additionally disposed on the encapsulation layer 300.

Referring back to FIG. 1, a polarization layer POL may be disposed onthe front surface of the display panel PA. The polarization layer POLcan reduce the reflectance of external light incident from the outside.In an exemplary embodiment, the polarization layer POL may include aretarder and a polarizer.

The polarization layer POL may completely cover the display area DA ofthe display panel PA. To do so, the area of the polarization layer POLmay be equal to or larger than the area of the display area DA whenviewed from the top.

In other implementations, the polarization layer POL may be eliminated.When the polarization layer POL is eliminated, a black matrix and/or acolor filter may be disposed on the display panel PA in order to preventcolor separation due to external light reflection.

The first adhesive layer AD1 may be disposed on the polarization layerPOL. In an exemplary embodiment, the first adhesive layer AD1 may haveoptical transparency to transmit an image generated in the display panelPA. To this end, the first adhesive layer AD1 may include an opticallyclear adhesive (OCA).

The cover window CW may be disposed on the first adhesive layer AD1. Inan exemplary embodiment, the cover window CW may be made of transparentglass or plastic. That is to say, the cover window W may be formed of alight-transmitting material. Accordingly, the image generated in thedisplay panel PA can be presented to the user through the cover windowW.

A support panel 400 may be disposed on the rear surface of the displaypanel PA. The support panel 400 may have a substantially plate-likeshape and can support the display panel PA.

In an exemplary embodiment, the support panel 400 may be made of plasticor rubber. It is, however, to be understood that the invention is notlimited thereto. For example, the support panel 400 may be made of amixture of plastic and rubber or may include other polymer materials.That is to say, the support panel 400 may be made of an elastic materialto mitigate and dampen the effects of an impact applied to the displaypanel PA.

As described above, when the display panel PA is bent along the bendingarea BA, the support panel 400 may be disposed between the drive IC 130and the display area DA.

Referring to FIGS. 1 and 2, the protective layer 500 may be disposed inthe first subsidiary non-display area NDA1.

The protective layer 500 may cover the bending area BA disposed in thefirst subsidiary non-display area NDA1. In an exemplary embodiment, theprotective layer 500 may entirely or partially cover the area betweenthe drive IC 130 and the display area DA.

The protective layer 500 may protect the bending area BA of the displaypanel PA. That is to say, if a stress, such as an external impact, isapplied to the bending area BA of the display panel PA when it is bent,the bending area BA may become vulnerable and/or damages due to theimpact stress thus generated. For this reason, by forming the protectivelayer 500 to cover the bending area BA, the external impact applied tothe bending area BA can be mitigated or prevented.

The protective layer 500 may be bent along the bending area BA. To thisend, the protective layer 500 may be formed of a flexible polymermaterial. The flexible polymer material may include, for example, resin.

The protective layer 500 may be bent together with the display panel PAalong the bending area BA. Accordingly, the protective layer 500 canpartially distribute the bending stress applied to the bending area BA.

In an exemplary embodiment, one end of the protective layer 500 mayextend to a portion where the drive IC 130 is disposed. Accordingly, theend of the protective layer 500 may come in contact with the drive IC130. In another exemplary embodiment, the end of the protective layer500 may extend to the vicinity of the drive IC 130, but may not be incontact with the drive IC 130.

In addition, the protective layer 500 may not cover the drive IC 130 ineither case.

In an exemplary embodiment, the protective layer 500 may not cover thedisplay area DA.

Further, in an exemplary embodiment, the opposite end of the protectivelayer 500 may not overlap with the polarization layer POL. That is tosay, the protective layer 500 may be formed only in a region where thepolarization layer POL covering the display area DA is not formed.

In addition, the opposite end of the protective layer 500 may extend tothe region where the polarization layer POL is disposed, and may come incontact with by abutting the end the polarization layer POL.

Referring to FIG. 2, the first cover member 600 may be disposed suchthat it covers the drive IC 130 and the protective layer 500.

The first cover member 600 may completely cover the drive IC 130 asshown in FIG. 2. That is to say, the drive IC 130 may be completelyoverlapped with the first cover member 600.

Since the first cover member 600 completely covers the drive IC 130, thefirst cover member 600 can prevent the drive IC 130 from beingcontaminated by foreign substances. In addition, by covering the driveIC 130 with the first cover member 600, it is possible to prevent thedrive IC 130 from being directly exposed to an external impact.

Since the first cover member 600 completely covers the drive IC 130, oneend of the first cover member 600 may be disposed under the supportpanel 400. More specifically, one end of the first cover member 600 maybe disposed between the drive IC 130 and the output pad unit 140. It is,however, to be understood that the invention is not limited thereto. Inanother exemplary embodiment, the first cover member 600 may furtherextend to the flexible printed circuit board FPC to cover the output padunit 140 and at least a part of the flexible printed circuit board FPC.

In an exemplary embodiment, the first cover member 600 may cover theprotective layer 500. Accordingly, the first cover member 600 may beoverlapped with the bending area BA. In addition, the opposite end ofthe first cover member 600 may extend to the area where the polarizationlayer POL is disposed. Accordingly, in an exemplary embodiment, theopposite end of the first cover member 600 may come in contact with andabut end of the polarization layer POL.

In an exemplary embodiment, the opposite end of the first cover member600 and the opposite end of the protective layer 500 may be aligned witheach other. Accordingly, the opposite end of the first cover member 600and the opposite end of the protective layer 500 may come in contactwith and abut the end of the polarization layer POL.

When the opposite end of the first cover member 600 extends to thepolarization layer POL, a part of the first cover member 600 may come incontact with the first adhesive layer AD1. Accordingly, the opposite endof the first cover member 600 may be interposed between the protectivelayer 500 and the cover window CW. That is to say, the opposite end ofthe first cover member 600 may be fixed by the first adhesive layer AD1attaching the cover window CW to the polarization layer POL. The firstcover member 600 may be bent along the bending area BA as shown in FIG.1, with the opposite end is fixed by the first adhesive layer AD1.

As described above, the bending area BA is relatively vulnerable toimpact while it is bent. When the first cover member 600 completelycovers the bending area BA, it is possible to mitigate or prevent theexternal impact generated during the process from being transmitted tothe bending area BA.

Next, the structure of the first cover member 600 will be described indetail with reference to FIG. 4.

Referring to FIG. 4, the first cover member 600 may include a firstinsulating layer 610, a conductive layer 620, and a second insulatinglayer 630 which are sequentially stacked on one another.

The first insulating layer 610 covers the upper surface of the drive IC130 and may directly contact and abut bottom of the drive IC 130.

If the conductive layer 620 comes in contact with the drive IC 130,noise may interfere with the signals generated in the drive IC 130. Forthis reason, the drive IC 130 can be completely insulated from theconductive layer 620 by the first insulating layer 610.

The first insulating layer 610 may be made of an organic insulatingmaterial. The organic insulating material may be, for example,polyethersulphone (PES), polyacrylate (PA), polyacrylate (PAR),polyetherimide (PEI), polyethylenenapthalate (PEN),polyethyleneterepthalate (PET), polyphenylenesulfide (PPS),polyallylate, polyimide (PI), polycarbonate (PC), cellulosetriacetate(CAT), cellulose acetate propionate (CAP), or combinations thereof.

The conductive layer 620 may be disposed on the first insulating layer610. The conductive layer 620 may be made up of a metal or a polymermaterial having electrical conductivity. For example, the metal mayinclude at least one of an aluminum (Al)-based metal including analuminum alloy, a silver (Ag)-based metal including a silver alloy, acopper (Cu)-based metal including a copper alloy, a molybdenum(Mo)-based metal including molybdenum alloy, chromium (Cr), titanium(Ti), and tantalum (Ta). It is, however, to be understood that the typeof the metal is not limited thereto. Any metal may be used as thematerial of the conductive layer 620 as long as it has electricalconductivity.

The second insulating layer 630 may be disposed on the conductive layer620. The second insulating layer 630 may completely cover the conductivelayer 620. Accordingly, the first insulating layer 610 and the secondinsulating layer 630 may be disposed such that they cover the rearsurface and the front surface of the conductive layer 620, respectively.That is to say, the front surface and the rear surface of the conductivelayer 620 may not be exposed to the outside by the first insulatinglayer 610 and the second insulating layer 630.

The conductive layer 620 may guide static electricity generatedirregularly according to the transfer of various signals in thenon-display area NDA. Specifically, undesirable static electricity maybe generated in the drive IC 130 or various wirings disposed in thenon-display area NDA as signals are transferred. Such static electricitymay affect the drive IC 130 or the adjacent wiring, resulting in signalinterference.

In this regard, when the first cover member 600 includes the conductivelayer 620 as described above, irregular static electricity generated atrandom locations in the non-display area NDA can be guided away and/ordispersed by the conductive layer 620. As a result, it is possible toprevent the static electricity from adversely affecting the flow ofsignals or the electrical characteristics of each wiring.

In addition, since a large number of wirings are densely arranged in thenarrow, non-display area NDA, electromagnetic noise may occur. When thefirst cover member 600 includes the conductive layer 620 as describedabove, by guiding and/or dispersing the undesirable electromagneticnoise generated along the conductive layer 620, it is possible toprevent the electromagnetic noise from adversely affecting the wirelesscommunications.

Hereinafter, a display device according to another exemplary embodimentof the invention will be described. Some of elements described below maybe identical to those of the display device according to theabove-described exemplary embodiment of the invention; and, therefore,description thereof may be omitted to avoid redundancy.

FIG. 5 is a cross-sectional view of a display device according to anexemplary embodiment of the invention.

Referring to FIG. 5, a display device according to the exemplaryembodiment of the invention may further include a second cover member650.

In an exemplary embodiment, the second cover member 650 may be disposedon the rear surface of the display panel PA. That is to say, unlike thefirst cover member 600 disposed on the front surface, the second covermember 650 may be disposed on the rear surface of the display panel PA.

The second cover member 650 may overlap with the bending area BA.Accordingly, the bending area BA may be interposed between the firstcover member 600 and the second cover member 650.

The second cover member 650 may be disposed on the rear surface of thedisplay panel PA and may be bent along the bending area BA. When thesecond cover member 650 is bent along the bending area BA, the secondcover member 650 may support the bending of the display panel PA at therear surface of the display panel PA.

Accordingly, the second cover member 650 can mitigate or block theeffects of an external impact applied to the bending area BA at the rearsurface of the display panel PA. In addition, as the second cover member650 is bent together with the bending area BA, the bending stressapplied to the bending area BA can be distributed, so that it ispossible to prevent the elements disposed in the bending area BA frombeing fatigued, damaged and/or broken.

In an exemplary embodiment, the second cover member 650 may be made ofthe same material as the first cover member 600. That is to say, asdescribed above with reference to FIG. 4, the second cover member 650may have a stacked structure in which the first insulating layer 610,the conductive layer 620, and the second insulating layer 630 aresequentially stacked on one another.

FIG. 6 is a cross-sectional view of a display device according to anexemplary embodiment of the invention.

Referring to FIG. 6, in an exemplary embodiment, a first cover member601 may include a first insulating layer 611, a conductive layer 621,and a second insulating layer 631 which are sequentially stacked on oneanother.

In an exemplary embodiment, the first insulating layer 611 may include afirst non-conductive adhesive layer NAD1 and a first sub-insulatinglayer IL1.

The first non-conductive adhesive layer NAD1 may be made of anon-conductive material which has an adhesive property and does notconduct electricity. In an exemplary embodiment, the firstnon-conductive adhesive layer NAD1 may be made of a material including aphotocurable resin or a thermosetting resin having a high transmittanceand adhesive property.

Accordingly, the first non-conductive adhesive layer NAD1 may come incontact with and attached to the drive IC 130.

In addition, the first non-conductive adhesive layer NAD1 may come incontact with or attached to a part of the protective layer 500.

In an exemplary embodiment, a first sub-insulating layer IL1 may beformed of an organic insulating material. The organic insulatingmaterial may include one or more selected from the group consisting of:polyethylene terephthalate (PET), polyethylene naphthalate (PEN),polyethylene sulfide (PES), and polyethylene (PE).

It is to be noted that the material of the first sub-insulating layerIL1 is not limited thereto.

The conductive layer 621 may be disposed on the first sub-insulatinglayer IL1. In an exemplary embodiment, the conductive layer 621 mayinclude a conductive adhesive layer CAD and a sub-conductive layer CL.

The conductive adhesive layer CAD may have electrical conductivity andan adhesive property. To this end, the conductive adhesive layer CAD maybe formed by mixing a metal or a conductive polymer with a resin havingadhesive property. Accordingly, the conductive layer 621 may be attachedto the first insulating layer 611 by the conductive adhesive layer CAD.

The conductive layer 621 may be disposed on the conductive adhesivelayer CAD.

The conductive layer 621 may be made up of a metal or a polymer materialhaving electrical conductivity. For example, the metal may include atleast one of an aluminum (Al)-based metal including an aluminum alloy, asilver (Ag)-based metal including a silver alloy, a copper (Cu)-basedmetal including a copper alloy, a molybdenum (Mo)-based metal includingmolybdenum alloy, chromium (Cr), titanium (Ti), and tantalum (Ta). Itis, however, to be understood that the type of the metal is not limitedthereto. Any metal may be used as the material of the conductive layer621 as long as it has electrical conductivity.

The second insulating layer 631 may be disposed on the conductive layer621.

In an exemplary embodiment, the second insulating layer 631 may includea second non-conductive adhesive layer NAD2 and a second sub-insulatinglayer IL2. In an exemplary embodiment, the second non-conductiveadhesive layer NAD2 may be made of a non-conductive material which hasadhesive property and does not conduct electricity. In an exemplaryembodiment, the second non-conductive adhesive layer NAD2 may be made ofa material including a photocurable resin or a thermosetting resinhaving a high transmittance and adhesive property.

The second insulating layer 631 may be attached to the conductive layer621 by the second non-conductive adhesive layer NCAD.

The second sub-insulating layer IL2 may be disposed on the secondnon-conductive adhesive layer NAD2. In an exemplary embodiment, thesecond sub-insulating layer IL2 may be formed of an organic insulatingmaterial. The organic insulating material may include one or moreselected from the group consisting of: polyethylene terephthalate (PET),polyethylene naphthalate (PEN), polyethylene sulfide (PES), andpolyethylene (PE).

It is to be noted that the material of the second sub-insulating layerIL2 is not limited thereto.

FIG. 7 is a view showing a display device according to another exemplaryembodiment of the invention. FIG. 8 is a cross-sectional view takenalong line II-II′ of FIG. 7.

Referring to FIGS. 7 and 8, a display device according to an exemplaryembodiment of the invention may further include a flexible printedcircuit board FPC and a ground electrode 700 disposed on the flexibleprinted circuit board FPC.

In an exemplary embodiment, one end of a first cover member 602 mayextend further toward the flexible printed circuit board FPC.Accordingly, the first cover member 602 may cover an output pad unit 140and at least a part of the flexible printed circuit board FPC, inaddition to a drive IC 130.

In an exemplary embodiment, at least one ground electrode 700 may beformed on the flexible printed circuit board FPC. The ground electrode700 may be disposed in an island-type shape at a position on theflexible printed circuit board FPC. In an exemplary embodiment, aconductive layer 620 of the first cover member 602 may be electricallyconnected to the ground electrode 700. That is to say, the conductivelayer 620 of the first cover member 602 may be connected to the groundelectrode 700, to be connected to the ground potential.

Referring to FIG. 8, the first cover member 602 may include an openingOP via which a part of the conductive layer 620 is exposed toelectrically connect the conductive layer 620 with the ground electrode700. The opening OP may be formed by recessing the first insulatinglayer 610 so that a part of the upper surface of the conductive layer620 is exposed.

Accordingly, the ground electrode 700 may come in contact with andelectrically connected to the conductive layer 620 via the opening OP.

Although FIG. 8 illustrates the example where the ground electrode 700and the conductive layer 620 are in direct contact with each other andelectrically connected to each other, they may be electrically connectedto each other in other ways. For example, in another exemplaryembodiment, an element having electrical conductivity may be interposedbetween the ground electrode 700 and the conductive layer 620 toelectrically connect them.

When the conductive layer 620 is connected to the ground electrode 700,static electricity or electromagnetic waves generated in the non-displayarea NDA may be guided toward the ground electrode 700 through theconductive layer 620. As a result, it is possible to prevent staticelectricity or electromagnetic waves from interfering with signals oradversely affecting the electrical characteristics of adjacent wirings.

FIG. 9 is a cross-sectional view of a part of a display device accordingto another exemplary embodiment of the invention. As described abovewith reference to FIG. 6, a first cover member 603 may include a firstnon-conductive adhesive layer NAD1, a first sub-insulating layer IL1, aconductive adhesive layer CAD, a sub-conductive layer CL, a secondnon-conductive adhesive layer NAD2, and a second sub-insulating layerIL2. According to this exemplary embodiment, the first cover member 603may be extended toward the flexible printed circuit board FPC and begrounded to the ground electrode 700.

To this end, the first cover member 603 may include an opening OP1 viawhich a part of a conductive adhesive layer CAD is exposed. The openingOP1 may be formed by recessing the first non-conductive adhesive layerNAD1 and the first sub-insulating layer IL1 so that a part of the uppersurface of the conductive adhesive layer CAD is exposed. Accordingly,the conductive adhesive layer CAD may come in contact with the groundelectrode 700 so that the conductive layer 621 may be connected to theground potential.

The same effects can be achieved as those described above with referenceto FIG. 8.

Hereinafter, a method for manufacturing a display device according to anexemplary embodiment of the invention will be described.

According to an exemplary embodiment of the invention, a method formanufacturing a display device includes: preparing a display panel PAhaving a display area DA and a non-display area NDA defined thereon, thenon-display area NDA being disposed on an outer side of the display areaDA and including a drive integrated circuit (IC) 130 therein; forming aprotective layer between the drive IC 130 and the display area DA;forming a first cover member 600 to cover the drive IC 130 and theprotective layer 500; and bending the display panel PA to form a bendingarea BA between the drive IC 130 and the display area DA.

Initially, the method may include preparing a display panel PA having adisplay area DA and a non-display area NDA defined thereon, thenon-display area disposed on the outer side of the display area DA andcomprising a drive IC 130 disposed in the non-display area NDA. Thedisplay panel PA may be substantially identical to the display panel PAdescribed above with reference to FIG. 2.

That is to say, a plurality of pixels PX may be arranged in the displayarea DA of the display panel PA. In addition, the non-display area NDAof the display panel PA may include the first subsidiary non-displayarea NDA1 including the bending area BA (FIG. 2 shows the bending areaBA before the display panel PA is bent) and the second subsidiarynon-display area NDA2.

The drive IC 130 may be directly mounted on the first subsidiarynon-display area NDA1.

A plurality of output lines 160 may be disposed between the drive IC 130and the display area DA. An output pad unit 140 may be disposed at oneend of the first subsidiary non-display area NDA1, i.e., on the outerside of the drive IC 130. A plurality of input lines 150 may be disposedbetween the output pad unit 140 and the drive IC 130.

The method for manufacturing a display device according to an exemplaryembodiment of the invention may further include forming a polarizationlayer POL on the display panel PA. The polarization layer POL may beformed to completely cover the display area DA. The order of forming thepolarization layer POL is not particularly limited herein. In anexemplary embodiment, the polarization POL may be formed before or afterthe protective layer 500 is formed. In other implementations, thepolarization layer POL may be formed after the bending step.

Subsequently, the method may include forming a protective layer 500between the drive IC 130 and the display area DA.

The forming the protective layer 500 may include applying a resinbetween the drive IC 130 and the display area DA and curing the resin.

The protective layer 500 may be formed to cover a bending area BA to beformed in a process described later.

In an exemplary embodiment, the protective layer 500 may come in contactwith the drive IC 130. It is to be noted that, even thought theprotective layer 500 is in contact with the drive IC 130, it may notcover the upper surface of the drive IC 130.

Subsequently, the method may include forming the first cover member 600covering the drive IC 130 and the protective layer 500.

The first cover member 600 may be substantially identical to that of anyof those described in connection with display devices constructedaccording to the exemplary embodiments of the invention.

The first cover member 600 may completely cover the upper surface of thedrive IC 130. In addition, the first cover member 600 may cover theprotective layer 500 and may cover the bending area BA to be formed in asubsequent process. In addition, the opposite end of the first covermember 600 may be extended to the vicinity of the display area DA.

Subsequently, the method may include bending the display panel PA toform the bending area BA between the drive IC 130 and the display areaDA. As shown in FIGS. 1 and 2, by bending the display panel PA, thebending area BA may be formed. As described above, the bending area BAmay be defined as an area having a curvature greater than zero at thefront or rear surface.

Since the protective layer 500 and the first cover member 600 thusformed overlap with the bending area BA, the protective layer 500 andthe first cover member 600 may be bent along the bending area BA at thebending step. Accordingly, the protective layer 500 and the first covermember 600 can mitigate the bending stress applied to the bending areaBA. FIG. 1 shows the display panel when it is bent. The protective layer500 and the first cover member 600 can protect the bending area BA whenit is bent, as described above.

A method for manufacturing a display device according to anotherexemplary embodiment of the invention may further include forming asecond cover member 650 on the rear surface of the display panel PAbefore the bending step.

The second cover member 650 may be disposed on the rear surface of thedisplay panel PA as shown in FIG. 5. When the second cover member 650 isattached to the rear surface of the display panel PA, the first covermember 600, the second cover member 650, and the protective layer 500may be bent along the bending area in the bending step. Accordingly, thefirst cover member 600, the second cover member 650 and the protectivelayer 500 may mitigate the bending stress applied to the bending areaBA.

In another exemplary embodiment, the method may further includeelectrically connecting a flexible printed circuit board FPC to thenon-display area NDA. In an exemplary embodiment, the electricallyconnecting the flexible printed circuit board FPC may be performed priorto the forming the first cover member 600.

In an exemplary embodiment, the forming the first cover member 600 afterthe flexible printed circuit board FPC is formed may include forming thefirst cover member 600 so that it covers the output pad unit 140 and apart of the flexible printed circuit board FPC.

In an exemplary embodiment, a ground electrode 700 may be disposed onthe flexible printed circuit board FPC (see FIG. 7).

According to this exemplary embodiment, the method may further includeconnecting the first cover member 600 to the ground electrode 700.

The step of connecting the first cover member 600 to the groundelectrode 700 may include recessing a first insulating layer 610 of thefirst cover member 600 in which the first insulating layer 610, aconductive layer 620 and a second insulating layer 630 are sequentiallystacked on one another to form an opening OP via which the conductivelayer 620 is exposed, and electrically connecting the conductive layerexposed via the opening OP with the ground electrode 700 (see FIGS. 8and 9 for more detailed description).

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. A display device comprising: a display panelhaving a display area and a non-display area, the non-display area beingdisposed at a peripheral portion of the display area and having abending area; an integrated circuit (IC) disposed in the non-displayarea to drive the display panel; a first layer formed between thedisplay area and the IC and covering the bending area; a first membercovering the IC and the first layer and overlapping with the bendingarea; an output pad unit disposed on an outer side of the IC in thenon-display area; and a ground electrode disposed on a flexible printedcircuit board; wherein the flexible printed circuit board electricallyconnected to the output pad unit, the first member is connected to theground electrode to reduce interference from static electricity orelectromagnetic waves in the non-display area.
 2. The display device ofclaim 1, wherein the first member comprises a first cover member havinga first insulating layer, a conductive layer disposed on the firstinsulating layer, a second insulating layer disposed on the conductivelayer, and having an opening exposing a part of the conductive layerthrough the first insulating layer, and wherein the conductive layercomes in contact with the ground electrode via the opening.
 3. Thedisplay device of claim 1, further comprising: a polarization layerdisposed on the display panel; a first adhesive layer disposed on thepolarization layer; and a cover window disposed on the first adhesivelayer.
 4. The display device of claim 3, wherein a part of the firstmember contacts the first adhesive layer, a part of the first member isdisposed between the first adhesive layer and the first layer, and thefirst layer and the first member abut the polarization layer.
 5. Thedisplay device of claim 1, further comprising: a support panel disposedbetween the display area and the drive IC, and wherein the first layercomprises a protective layer and the first member comprises a firstcover member.
 6. The display device of claim 1, wherein the ICcompletely overlaps the first member.
 7. The display device of claim 1,further comprising: a second member disposed on the display panel andoverlapping with the bending area.
 8. A display device comprising: adisplay panel having a display area and a non-display area, thenon-display area being disposed at a peripheral portion of the displayarea and having a bending area; an integrated circuit (IC) disposed inthe non-display area to drive the display panel; a first layer formedbetween the display area and the IC and covering the bending area; and afirst member covering the IC and the first layer and overlapping withthe bending area, wherein the first member comprises a first insulatinglayer, a conductive layer disposed on the first insulating layer, and asecond insulating layer disposed on the conductive layer.
 9. The displaydevice of claim 8, wherein the first insulating layer abuts the IC. 10.The display device of claim 8, wherein the first insulating layercomprises a first non-conductive adhesive layer, the conductive layercomprises a conductive adhesive layer, and the second insulating layercomprises a second non-conductive adhesive layer.
 11. A display devicecomprising: a display panel having a display area and a non-displayarea, the non-display area being disposed at a peripheral portion of thedisplay area and having a bending area; a integrated circuit (IC)disposed in the non-display area to drive the display panel; a firstlayer formed between the display area and the IC and covering thebending area; a first member covering the IC and a protective layer andoverlapping with the bending area, and comprises a conductive member toreduce interference from static electricity or electromagnetic waves inthe non-display area; and a ground electrode disposed on a flexibleprinted circuit board; wherein the conductive member is connected to theground electrode.
 12. A method for manufacturing a display device, themethod comprising the steps of: preparing a display panel having adisplay area and a non-display area, the non-display area being disposedat a peripheral portion of the display area and having an integratedcircuit (IC) therein; forming a protective layer between the IC and thedisplay area; forming a first member to cover the drive IC and theprotective layer; bending the display panel to form a bending areabetween the drive IC and the display area; connecting a flexible printedcircuit board to the non-display area; forming a ground electrode on theflexible printed circuit board; and connecting the first member to theground electrode.
 13. The method of claim 12, further comprising thestep of: disposing a second member on a the display panel.
 14. Themethod of claim 12, wherein the first member further comprises a firstcover member that partially covers the flexible printed circuit board.15. The method of claim 12, wherein the first cover member comprises afirst insulating layer, a conductive layer and a second insulating layerstacked on one another, and wherein the step of connecting the firstcover member to the ground electrode comprises recessing the firstinsulating layer to form an opening via which the conductive layer isexposed, and electrically connecting a part of the conductive layerexposed via the opening with the ground electrode.